Nikon XTV160
SKU: Ni-XTV160
XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of next-generation wafer-level, semiconductor device and PCBA applications. Equipped with an in-house designed X-ray NanoFocus source and high precision manipulator, this industry-leading inspection system offers unrivalled feature recognition compared to any product available on the market today. As such, the XT V 160 NF is indispensable for any electronics development and production environment.
3D analysis
The 3D analysis option on the XT V 160 NF is based on laminography reconstruction techniques, providing sub-micron defect recognition. It provides a method of inspecting a region of interest which can be challenging to inspect with 2D radiography, such as 3D stack dies or BGA pad cracks. From the 3D model it is possible to view any plane of a sample from any direction without the need to isolate or cut the interest area.
Applications
The continued demand for high performance electronics is driving packaging technology towards tighter density, higher IO capabilities and most importantly reduced footprint.
Modern X-ray inspection systems must provide the highest magnification, sharpest imaging and uncompromised accuracy.
•Through Silicon Via (TSV) filling and voids
•Cu-Pillar, micro-bump cold joint detection and void analysis
•BGA voids, size measurements, cold joint and head-in-pillow detection
•Ultra-fine pitch bond wire analysis: ball bond, broken wire, wire sweep, stitch bond
•QFN/QFP inspection including automated pad void array analysis
•3D stack die and Pack-on-Package (POP)
•MEMS applications with narrow density variations
•Complete automated wafer inspection for micro-bump metrology
Key benefits
•<0.1 μm feature recognition up to 6 W power
•High precision manipulator with vibration reduction
•3 Mpixel flat panel for ultra high definition
•Large tray to load multiple components and boards as well as 450 mm wafer ready
•Productivity increase by automation and instant reporting
kV range
30-160 kV
Max. beam current
600 μA
Max. tube power
20 W
Min. feature recognition
<0.1 μm up to 6W tube power
Geometric magnification
up to 2,400x
Detector
3Mpixel (1,944 x 1,536 pixels)
75 μm pixel size
26 fps update rate
Max. inspection area
510 × 510 mm
Max. board size
580 × 580 mm
Max. tilt angle
60°
Cabinet size
W: 1,819 mm (excl. operator console)
H: 1,998 mm
D: 1,728 mm
Vibration isolation
Anti-vibration mounts (standard)
Monitor
Single 30” or dual 22” display
X-ray safety
1 μSv/hr (to IRR 99)
Speak to a Scientist
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